| |
Product Features: |
| |
|
 Original DISP Technology (Dynamic multi-frame Images Seamless Patchwork) |
| |
|
It has renovated the traditional way which industry operates, and firstly has achieved dynamic seamless patchwork of multi-frame Images of the entire PCB. |
| |
|
It enables the real time display of entire PCB images, thus it brings the maximum convenience and simplicity for making inspection program and verifying defects alarm. |
| |
|
Innovative GPU Parallel Operation technology instead of the traditional CPU operation |
| |
|
It has filled the industry blank, and firstly adopt GPU Parallel Operation technology in machine vision industry. It enormously reduced the image processing time. |
| |
|
It puts the Global Pattern Match for Entire PCB Image into the reality. Therefore, this product can assist to inspect the Extra-Component or Solder Ball in random place of the PCB. |
| |
|
Advanced VISTA Operating System with its core technology-DX10 |
| |
|
System software successfully achieved easy and visualized VISTA style interface and prompt operation mode. |
| |
|
Due to the visualized, easy, flexible, and broad system software, the way of making program has been dramatically simplized, and since then, it has become to be no longer complicated or tough. |
| |
|
Optimized Combination of ultra high resolution Image Capturing System and high precision Mechanism Driving System |
| |
|
It ensures the accurate and stable inspection capability on the micro-size components such as 01005 chip component and 0.3mm fine pitch size IC lead. |
| |
|
The inspection efficiency and repeatability has been plentifully enhanced. |
| |
Inspection Items: |
| |
|
| Post-Reflow |
Missing, Excess, Solder Ball, Shift, Billboard, Tombstone, Reverse, Polarity, Wrong, Broken, Bridge, Dryjoint, Wrong Mark, No Solder, Insufficient Solder, Excess Solder, Chip Lift, IC Lead Lift, IC Lead Bent, XYθ offset data output, etc. |
| Pre-Reflow |
Missing, Excess, Shift, Billboard, Reverse, Polarity, Wrong, Broken, Bridge, Dust, Wrong Mark, XYθ offset data output, etc. |
| Post-Printer |
No Paste, Insufficient Paste, Excess Paste, Shift, Bridge, Dust, Scratch, etc. |
|
| |
Specifications: |
| |
|
| Product Model |
HL-LX-520iL |
| Applicable PCB |
Applicable Process |
Post-Reflow |
Pre-Reflow |
Post-Printer |
| PCB Size |
50x50 mm ~ 520x480 mm |
| PCB Thickness |
0.3 mm ~ 4 mm |
| PCB Warp Tolerance |
+/- 3 mm (Support Pins as standard for conquering PCB warpage.) |
| PCB Clearance |
Above PCB: ≤40mm; Below PCB: ≤40mm |
| Vision System |
Camera System |
Color Digital Camera |
| Lighting System |
LED Lighting (Coaxial + Multi-degree Side Lighting) |
| Resolution |
13,16,19 um |
| Inspection Method |
Color Calculation, Color Extraction, Gray Scale Calculation, Image Comparison, Entire PCB Pattern Match, OCV, etc. |
| Mechanism System |
X/Y Driving System |
AC Servo Motor + Precision-Ball Screws |
| X/Y Resolution |
1 um |
| Positioning Repeatability |
8 um |
| Moving Speed |
830 mm/s (Max) |
| Rail Adjustment |
Manual |
| Software System |
Operating System |
Windows VISTA |
| Interface Language |
Chinese/English Optional Interface |
| Inspection Result Output |
Board ID, Board Name, Component Name, Defect Name, Image, etc. |
| Option Parts |
Offline Programming System, SPC System, Barcode Recognition System, etc. |
| Power Supply |
AC220V±10%, 50/60HZ, 1KW |
| Operating Temperature |
10 to 40 ℃ |
| Operating Humidity |
10 to 85% RH (No Condensing) |
| Product Weight |
200 Kg |
| Dimensions |
(W)878mm x (D)1032mm x (H)736mm |
|
|
